300/450mm N2 Purge Solutions



N2 Purge Application — Contribution to Next Generation Technology


  • Prevent cross contamination and surface oxidation

  • Control wafer in FOUP during process by Load Port N2 purge function

  • Superior stable placement

  • Control nozzle upward timing

  • Compatibility of non-N2 purge applicable FOUPs

  • Interference avoidance with kinematic pin at FOUP placement

  • Adjustment function of nozzle pressure

  • Nozzle up and down position checking function (Sensor)

  • N2 purging on carrier base

  • Adapted FOUP Type: A-300, SPECTRA (4 Port Purge Type: 2 inlet, 2 outlet ports)

  • Applicable to other N2 purge type FOUPs

  • Monitoring N2 gas flow rate by flow meter

  • Preventing contamination through purge port

  • Gas-Filter at inlet port side

  • Adhesion to grommet of FOUP side





 

 

Semiconductor Handling

It is our mission to provide all handling components and proper integration needed for Semiconductor Tool Automation.

The range of products that we provide cover all components used for the entire Front End Handling (EFEM), such as atmospheric robots, prealigner, load ports, wafer ID reader, etc. as well as all handling equipment needed for process tool automation such as atmospheric or vacuum robots. These products are available either as individual handling component or in any combination needed.

A single interface providing communication with all components allows our customers to concentrate on their core business with the knowledge that all handling requirements are well controlled and all components are perfectly coordinated.